Events Schedule

As the use of additive manufacturing (AM) continues to expand across a wide range of industries, so do the needs to better handle the fluids used throughout AM processes. From the raw materials (like resins) to the solutions that clean equipment, involved fluid management supports key AM goals of speed, quality and sustainability. Learn how choosing the right connector technologies contributes to these objectives.

Thermal LIVE Summit, now a bi-annual virtual event, is organized by Electronics Cooling for thermal engineers. Event registrants can attend live and interact with presenters, posing their thermal management questions to engineers from various cooling system component manufacturers or watch session recordings at their convenience post-event.  

“Rigor in Evaluation of Components for Liquid Cooling”

By understanding various aspects of development of components and knowing that all components from various manufacturers interact within a larger system, thermal engineers will be able to more confidently engage both suppliers as well as peer design engineers regarding requirements, product selection and validation for the thermal management applications that they are designing.

Speakers

Emma Miller Applications Engineer II CPC (Colder Products Company)

 

Koray Sekeroglu Principal Research Engineer CPC (Colder Products Company)

Design engineers will develop a deeper understanding of engineering materials, the advantages of these materials compared to commodity materials and how they contribute to better product design. 

CPC has assembled a team of industry-leading engineers to answer commonly received liquid cooling questions. Produced in collaboration with Electronics Cooling, this webinar event includes short presentations by Matthew Archibald, director of technical architecture at nVent; Pedro Fernandez, senior mechanical engineer at AcBel; and La Her, senior design engineer at CPC. Throughout, event participants will have the opportunity to ask their own questions of the presenters. Hear their replies and learn best practices as these experts provide tips for mechanical engineers designing liquid cooling of electronics systems from everything from power rectifiers to server blades.

Registrants who are unable to watch the live session will have access to the recording for viewing at their convenience post-event.  

As cell and gene therapy companies work to deliver life-changing results to as many people as possible, questions about scale loom large.
 
Fluid path optimization helps unlock the scaling potential. Aseptic connectors support this goal by eliminating the need for specialized tools and equipment and creating sterile connections even in non-sterile environments.
 
In this GEN webinar, our distinguished speaker, Eoin Dolan, will review the topics of process safeguarding, operator convenience, and true scalability solutions, in addition to presenting cost-benefit considerations.

In this webinar you will learn:

• A complete and validated method for aseptically connecting most tubing-based operations without biosafety cabinets or capital equipment expenditures.
• How aseptic solutions support scale-up while addressing misprocessing concerns.
• The ways in which single-use systems are increasingly being used in cell and gene therapy applications

Thermal LIVE Summit is an annual virtual event for thermal engineers organized Electronics Cooling. Event registrants can attend live and interact with presenters, posing their thermal management questions to engineers from various cooling system component manufacturers or watch session recordings at their convenience post-event.