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    Liquid Cooling Couplings for Semiconductor Testing

    Demand Creates Density

    Semiconductors are the essential component of computing systems. To drive applications―such as 5G, advanced medical imaging systems, transportation and high-performance computing (HPC) ―requires increasingly densely packed semiconductor packaging. The growing demand for these new chipsets necessitates more and more sophisticated testing to ensure the semiconductors, and their associated integrated circuits, are not defective and meet all specifications.

    Liquid Cooling an Effective Alternative

    Just as semiconductors themselves generate a high level of heat, the same is true for the lasers and computing systems that are used in semiconductor testing. When semiconductor testing machines overheat, the testing process slows down and throughput decreases or it halts completely. Previously, testing systems were air cooled but this method of thermal management no longer suffices given the volume, speed and size of semiconductors being tested today. Simply put, air cooling is inefficient and often lacks the cooling capacity required by the testing equipment used on semiconductors and integrated chips. Using liquid cooling helps semiconductor testing get done faster and with the accuracy that the industry demands.

    Liquid Cooling Benefits for Semiconductor Testing

    • Analyze semiconductor component failures
    • Assess semiconductor functionality
    • Determine semiconductor performance

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    CPC Quick Disconnects Make Liquid Cooling Easier to Use

    In collaboration with our customers, CPC is supporting the liquid cooling applications that help semiconductor testing companies meet the strictest of temperature standards used when testing. From functional testing to system level testing, CPC understands the major challenges of performance, reliability and efficiency faced by semiconductor chip test engineers. Liquid cooling is crucial in meeting these challenges.

    How do Everis® Quick Disconnects Make Liquid Cooled Semiconductor Testing More Efficient?

    • Ergonomic, streamlined design
    • Lightweight for improved operator handling
    • Compact size facilitates installation in tight testing spaces
    • Prevents leaking of liquid coolants in an environment that is not at all tolerant to leaks
    • Makes hot swapping testing systems quick and easy

    CPC Everis® quick disconnect (QD) couplings are a key component in liquid cooling systems such as those used in the chip testing systems used by semiconductor manufacturers and testing facilities. Our liquid cooling experts understand the complexities of liquid cooling system components and the need for efficient and economical liquid cooling couplings in semiconductor testing applications. Our team, including materials scientists, design engineers and applications engineers, exclusively focuses on liquid cooling QDs. This focus delivers a robust portfolio of CPC Everis QDs expressly for a wide range of high heat electronic and laser applications including semiconductor testing.

    View Everis Quick Disconnects

    Myriad of Liquid Cooling Coupling Options for Semiconductor Testing

    Everis connector options―size, materials, features, configurations―meet the requirements of liquid cooling systems used by semiconductor testing done around the world. With features like non-spill shutoff valves and locking hose barb terminations, CPC Everis Series offers the quick disconnect couplings options you need.

    Everis’ application-specific design and robust product testing assist in reaching performance and efficiency objectives while helping you to meet the increasingly sophisticated testing demands for semiconductors and integrated circuits.

    Additional Information on Fluid Handling for Liquid Cooling Systems

    Chemical Compatibility in Liquid Cooling Solutions

    Chemical compatibility within a liquid cooling loop helps the system performs to specification. With ongoing advances in fluid options and materials, it is important to think holistically when specifying coolant and components, taking into consideration potential interactions.

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